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Fine Pitch Surface Mount Technology
Buch
Buch
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Fachbuch
1992

Fine Pitch Surface Mount Technology

Quality, Design, and Manufacturing Techniques

ISBN
EAN
978-0-442-00862-8
9780442008628
Artikel-Nr.
EN4QPGR
Kostenloser Versand
Rabatt
-13.4
%
CHF 255.00
CHF
220.88
Anzahl
1
Maximale
Lieferzeit
13
Arbeitstage
Montag
11.10.2021
speech-bubble-svg Beschreibung
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Inhaltsverzeichnis
Preface; Acknowledgments; Introduction to fine pitch technology (FPT); The family of FPT packages; Fine pitch product applications; Printed circuit boards for fine pitch technology; Solder and application methods; Package placement; Solder reflow; Post reflow cleaning; Inspection, rework, and repair; Design for reliability guidelines; Design for testability; Design for manufacturability; Specific guidelines for FPT packages; Appendices; Glossary; Index
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Herausgeber/-in
Autor/-in
Zielgruppe
Research
Publikation
Vereinigte Staaten
31.07.1992
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Sprache
Englisch
book-svg Format
Hardcover
340 Seiten
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Kostenloser Versand: Schweiz & Liechtenstein
Für den Versand nach Deutschland oder Frankreich werden die Versandgebühren der Schweizerischen Post berechnet. Diese werden Ihnen im Warenkorb für Ihre gesamte Bestellung berechnet.
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