Erhältlich:
Nicht auf Lager
Buch (Hardcover): Fachbuch
Electronic Packaging Materials and Their Properties
Produkt bewerten
Verlag:
Taylor & Francis Unsere-Artikel-Nr.: P35170118
EAN: 9780849396250
Erhältlich:
Nicht auf Lager
Zustellung: Di, 08.09.2026
Versand: Kostenlos
-23.0 %
CHF 296.–
CHF 228.–
Beschreibung
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The book also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Spezifikationen
Sprache
- Englisch
Autor
- Pecht Michael
- Agarwal Rakish
- McCluskey F. Patrick
- Dishongh Terrance J.
- Javadpour Sirus
- Mahajan Rahul
Zielgruppe
- Professional
Erscheinungsjahr
- 1998
Format
- Buch (Hardcover)
Anzahl Seiten
- 120