Erhältlich:
Nicht auf Lager
Buch (Softcover): Fachbuch
High-speed Digital Design & Signal Integrity Handbook
Transmission Lines, PCB Stackups, Power Integrity, High-Speed Interfaces, Measurement, Modeling, and Simulation
Verlag:
Independently Published Unsere-Artikel-Nr.: P36740470
EAN: 9798190555752
Erhältlich:
Nicht auf Lager
Zustellung: Di, 13.10.2026
Versand: Kostenlos
CHF 121.–
Beschreibung
A trace that looks like a simple copper line stops behaving like one past a few hundred megahertz. A complete, practice-focused reference for hardware, signal integrity, and PCB design engineers working at multi-gigabit data rates, where transmission-line theory, power integrity, and protocol timing all have to close on the same board. This handbook assumes a working engineer's vocabulary and moves directly into the analysis, tradeoffs, and design judgment needed to ship boards that work in volume - not an introduction to electronics, but a reference for engineers already past that stage. Organized across twenty-one chapters in five practical modules:. Foundations:. why digital signals are really analog, electromagnetic phenomena, and the field-theory grounding every later chapter depends on. PCB and Power-Integrity Core:. transmission-line theory and controlled impedance, reflections and termination, PCB materials and loss, stackup engineering, high-speed routing and vias, crosstalk and simultaneous switching, and the power-distribution network from target impedance through decoupling and plane-resonance control. Timing and Interface Standards:. jitter, eye diagrams, and bit-error rate; SerDes channel architecture, equalization, and clock recovery; PAM4 signaling; DDR and LPDDR memory interfaces; and PCIe and CXL peripheral interfaces. Packaging:. packages, connectors, cables, and system-level channel budgeting, then semiconductor I/O, advanced packaging, chiplets, die-to-die interconnects, and HBM. Measurement and Modeling:. oscilloscope, probe, TDR, and VNA measurement technique; SPICE, IBIS, and S-parameter modeling methodology; and systematic validation and root-cause troubleshooting. Every technical chapter includes:. Learning Objectives and Key Terms, fully worked numerical Design Examples showing every intermediate step, Design Checklist and Field Worksheet boxes built for reuse on an active project, and Practice Problems with a full instructor answer key available separately to qualified adopters. Chapter 21 closes the book with six illustrative, scenario-based case studies - an FPGA and DDR processing board, a PCIe accelerator card, a high-speed networking or storage backplane, a mixed-signal embedded controller, a server-class AI compute platform, and a forensic investigation of a board that failed in the field - each built to span the range of programs an engineer is likely to encounter across a career, not an account of any real company or product, and each closing with a synthesis checklist distilling the common workflow lessons. The book closes with a full Glossary and eight working reference sections:. semiconductor I/O terminology, a package-parasitic reference table, a process-voltage-temperature corner checklist, an advanced-package comparison matrix, a die-package-board co-design checklist, a chiplet and die-to-die design-review checklist, an HBM signal- and power-integrity checklist, and a semiconductor model-quality checklist. Whether you are closing a DDR5 timing budget, chasing a via stub resonance, sizing a decoupling network against a target impedance, or bringing up a PAM4 SerDes link for the first time - this handbook is built to be used against a real schedule, not read once and shelved.
Spezifikationen
Sprache
- Englisch
Autor
- Calder H Ventor
Erscheinungsjahr
- 2026
Format
- Buch (Softcover)
Anzahl Seiten
- 552