Three-Dimensional Integration of Semiconductors

Processing, Materials, and Applications

Produkt bewerten

Kazuo Kondo

▪Morihiro Kada

▪Kenji Takahashi

Verlag:

Springer Verlag

Unsere-Artikel-Nr.: 6LN82NY

EAN: 9783319186740

Erhältlich:

Nicht auf Lager

Zustellung: Do, 16.07.2026

Versand: Kostenlos

-22.6 %

CHF 135.–

CHF 104.50

Beschreibung

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Spezifikationen

Sprache

Englisch

Autor

Kazuo Kondo
Morihiro Kada
Kenji Takahashi

Thema

Gesundheitsberufe: Biomedizinische Technik
Chemie: Elektrochemie & Magnetochemie
Maschinenbau: Allgemein
Elektrotechnik: Allgemein
Elektronik: Geräte & Materialien

Zielgruppe

Professional/practitioner

Erscheinungsjahr

2015

Erscheinungsland

Schweiz

Format

Buch (Hardcover)

Anzahl Seiten